MediaTek Launches Dimensity 9600 Pro on TSMC 2nm Process
MediaTek Inc. (TPE: 2454) launched the Dimensity 9600 Pro, its first mobile processor built on the 2nm N2P process from Taiwan Semiconductor Manufacturing Co. (NYSE: TSM), putting the company among the first to ship flagship silicon on the node.
The chip carries 33 billion transistors and takes an unusual approach to its CPU. There are no efficiency cores at all. The 2+3+3 configuration runs two Arm C2-Ultra cores at 4.55GHz, three C2-Pro cores at 4.35GHz and three further C2-Pro cores at 3.1GHz, every one of them performance class, with 34.5MB of combined L2, L3 and system cache.
MediaTek puts the gains at 17% in single-core and 15% in multi-core against the Dimensity 9500, with multi-core power consumption down 61% and ultra-core power down 37%. At the node level, moving from 3nm to 2nm accounts for roughly 14% of the performance and 23% of the power reduction. The chip supports LPDDR6 memory and UFS 5.0 storage.
The AI positioning rests on a dual NPU architecture and what MediaTek calls an Agentic AI Engine, with prompt processing latency improved by 51% before inference begins.
Independent benchmarking is less flattering. Early Geekbench 7 results on an Oppo Find X10 Pro Max prototype showed 3,242 single-core against 3,582 for Qualcomm's Snapdragon 8 Elite Extreme Gen 6. Thermal tuning on a prototype may shift that.
Confirmed launch partners are Vivo and Oppo, neither with significant Western retail presence. A companion Dimensity 9600M uses TSMC's 3nm node for the wider premium segment.
